Wiring substrate and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsKentaro KANEKO, Toshimitsu Omiya, Kotaro Kodani, Junichi Nakamura, Kazuhiro Kobayashi
Life of this patent
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Abstract
A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.
Claims12
A wiring substrate, comprising:
- an insulating layer;
- a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer;
- and
- a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad.
A method of manufacturing a wiring substrate, comprising:
- forming a resist in which an opening portion is provided, on a supporting plate;
- forming a concave portion in the supporting plate through the opening portion of the resist;
- forming a metal layer for a connection pad in the concave portion of the supporting plate and the opening portion of the resist, by an electroplating utilizing the supporting plate as a plating power feeding path;
- removing the resist;
- forming a ring-like part of the supporting plate around an outer periphery part of the metal layer as a convex level difference portion whose height is higher than other etched surfaces, by etching the supporting plate;
- forming an insulating layer covering the metal layer, on the supporting plate;
- and
- exposing the metal layer by removing the supporting plate.
A method of manufacturing a wiring substrate, comprising:
- forming a resist in which an opening portion is provided, on a supporting plate;
- forming a laminated metal layer by forming a sacrifice metal layer and a metal layer for a connection pad sequentially on the supporting plate in the opening portion of the resist, by an electroplating utilizing the supporting plate as a plating power feeding path;
- removing the resist;
- forming a ring-like part of the supporting plate around an outer periphery part of the laminated metal layer as a convex level difference portion whose height is higher than other etched surfaces, by etching the supporting plate;
- forming an insulating layer covering the laminated metal layer, on the supporting plate;
- and
- exposing the metal layer for the connection pad, by removing the supporting plate and the sacrifice metal layer.
Dependencies are inferred from the claim text.