Package substrate with mesh pattern and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMi Jin PARK, Seung Wook PARK, Romero CHRISTIAN
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Abstract
Disclosed herein are a package substrate and a method for manufacturing the same. According to an exemplary embodiment, there is provided a package substrate with a mesh pattern, including: a plurality of bonding pads forming sections connected with the outside; an insulating layer formed below the plurality of bonding pads; and a metallic layer placed below the insulating layer and having the mesh pattern in at least a partial area thereof and capacitance is provided by a combination of the mesh pattern and the insulating layer that infiltrates into a space for the mesh pattern. Further, there is provided a method for manufacturing the package substrate with the mesh pattern.
Claims20
A package substrate with a mesh pattern, comprising:
- a plurality of bonding pads forming sections connected with the outside;
- an insulating layer formed below the plurality of bonding pads;
- and
- a metallic layer placed below the insulating layer and having the mesh pattern in at least a partial area thereof.
A method for manufacturing a package substrate with a mesh pattern, the method comprising:
- forming a metallic layer having the mesh pattern in at least a partial area thereof;
- stacking an insulating layer on the metallic layer;
- and
- forming, on the insulating layer, a plurality of bonding pads forming sections connected with the outside.
Dependencies are inferred from the claim text.