US 2013/0075143 A1 · ELECTRONIC COMPONENT MODULE AND ITS MANUFACTURING METHOD

Abstract

The electronic component module includes a substrate; an electronic component mounted on an electronic component mounting surface of the substrate; an insulating body that covers the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by electroless plating, the metal film covering an exterior surface of the insulating body and a side surface of the substrate. The substrate has a space section in which a space is formed, the space being dented inward of the substrate in the periphery of a surface opposite to the electronic component mounting surface of the substrate, and the metal film entirely covers at least one side surface of the electronic component module except for at least a portion located on a surface perpendicular to the electronic component mounting surface of the substrate in the space section.

Claims11

Dependent claims

An electronic component module comprising:

a substrate;
an electronic component mounted on an electronic component mounting surface of the substrate;
an insulating body that covers the electronic component on the electronic component mounting surface of the substrate;
and
a metal film formed by electroless plating, the metal film covering an exterior surface of the insulating body and a side surface of the substrate, wherein
the substrate has a space section in which a space is formed, the space being dented inward of the substrate in the periphery of a surface opposite to the electronic component mounting surface of the substrate, and
the metal film entirely covers at least one side surface of the electronic component module except for at least a portion located on a surface perpendicular to the electronic component mounting surface of the substrate in the space section.

4 more elements

An electronic module manufacturing method comprising:

mounting an electronic component on an electronic component mounting surface of a substrate;
covering the electronic component with an insulating body on the electronic component mounting surface of the substrate;
in a state where the substrate is disposed on a predetermined sheet member, cutting into a piece of electronic component module or a set of electronic component modules while remaining at least a part of the sheet member;
covering an exterior surface of the insulating body and a side surface of the substrate with a metal film by electroless plating;
and
before the substrate is disposed on the predetermined sheet member, providing a space section in which a space, dented inward of the substrate, is formed in at least a part of the periphery of a surface opposite to the electronic component mounting surface of the substrate in a state where the electronic component module or the set of electronic component modules are cut.

3 more elements

Dependencies are inferred from the claim text.

Electronic component module and its manufacturing method

Life of this patent

Electronic component module and its manufacturing method

Life of this patent

Abstract

Claims11