Adhesive composition, use thereof, connection structure for circuit members, and method for producing same
AssigneeHitachi Chemical Company, Ltd.
InventorsHiroyuki Izawa, Shigeki Katogi
Life of this patent
Estimating the term…
Abstract
An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.
Claims12
An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein:
- the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C.,
- the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and
- the adhesive composition includes a phosphate group-containing compound,
- the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.
Dependencies are inferred from the claim text.