Preparing a substrate for embedding wire
AssigneeFeinics Amatech Nominee Limited
InventorDavid Finn
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AssigneeFeinics Amatech Nominee Limited
InventorDavid Finn
Estimating the term…
A portion of the surface of a substrate may be prepared for mounting an antenna wire such as by removing material to form a sequence of ditches (holes) separated by bridges (lands), and conforming to the pattern for the antenna, which is typically a flat squared spiral, having a number of turns. The antenna wire may be laid in the ditches and embedded in the bridges. Additional features, such as undermining or removing material from adjacent the bridges may facilitate displacement of substrate material at the bridges. The collapsed bridges form pinch points, securing the wire in the substrate. In some embodiments of the invention, relevant portions of the substrate are prepared for embedding antenna wire, without removing material. The substrate may be an inlay substrate or card body for a secure document.
A method of mounting a wire to a substrate for an electronic device comprising:
Dependencies are inferred from the claim text.