Thermoelectric cooling system utilizing the thomson effect

Abstract

Thermoelectric cooling systems are disclosed that utilize the Thomson effect. The disclosed systems can be used, for example, in cryogenic applications. In one aspect, a system is provided for thermoelectric cooling. The system comprises a pair of semiconductor elements, a cold plate and a hot plate. The pair of semiconductor elements comprises a P-type semiconductor element having a first carrier concentration and an N-type semiconductor element having a second carrier concentration. The first carrier concentration is functionally graded over the P-type semiconductor element and the second carrier concentration is functionally graded over the N-type semiconductor element. Each semiconductor element has a cold end and a hot end. The cold plate is thermally coupled to the cold ends of the P-type semiconductor elements and the N-type semiconductor element. The hot plate is thermally coupled to the hot ends of the P-type semiconductor element and the N-type semiconductor element.

Dependencies are inferred from the claim text.