Thermoelectric module and manufacturing method for thermoelectric module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJu Hwan YANG, Dong Hyeok Choi, Sung Ho Lee
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJu Hwan YANG, Dong Hyeok Choi, Sung Ho Lee
Estimating the term…
The present invention is related to a thermoelectric module and a method for manufacturing the same. The thermoelectric module includes a substrate, a bottom electrode and a thermoelectric semiconductor. The thermoelectric module further includes an insulating layer integrally formed on a whole exposed surface of the bottom electrode, a portion of exposed surface of the thermoelectric semiconductor and a portion of exposed surface of the substrate; a contact hole provided in the insulating layer to expose a portion of a top surface of the thermoelectric semiconductor; and a top electrode to electrically connect at least two thermoelectric semiconductors by being formed on a surface of at least two thermoelectric semiconductors exposed by the contact hole and a portion of a top surface of the insulating layer.
A thermoelectric module provided with a substrate, a bottom electrode and a thermoelectric semiconductor comprising:
A method for manufacturing a thermoelectric module comprising:
A method for manufacturing a thermoelectric module comprising:
A method for manufacturing a thermoelectric module comprising:
Dependencies are inferred from the claim text.