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US 2013/0074331 A1Published application
Method for assembling a chip in a flexible substrate
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorJean Brun
Life of this patent
Estimating the term…
Abstract
A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate.
Claims15
1-14. (canceled)
A method for assembling an electronic chip on a flexible substrate comprising the following steps:
- providing the flexible substrate provided with at least one electrically conducting wire and with a polymerizable material,
- making the polymerizable material react in a first area of the flexible substrate so as to stiffen this first area of the flexible substrate and to form a housing area of the electronic chip on a surface of the flexible substrate, the housing area representing a more rigid area of the flexible substrate,
- arranging the electronic chip in the housing area and electrically connecting the electrically conducting wire with an electric connection area of the chip.
Dependencies are inferred from the claim text.