Adjusting device of wafer machine
OwnerYung-Chiu Huanginventor
Life of this patent
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Abstract
The present invention relates to an adjusting device of wafer machine, which includes a rotary adjustment assembly that is rotatable to cause the rotation of a rod so as to displace a support block thereby elevating or lowering a support post. A balance board is thus caused to move a wafer substrate so as to realize balancing of wafer through the support post, whereby efficient adjustment of the wafer machine to a balanced position can be achieved without extra expense of time in adjustment operation and thus accelerating the time of manufacturing process and providing extremely high precision and further effectively reducing the potential risk of damage caused by over-adjustment.
Claims11
A wafer machine adjusting device, which uses the machine adjusting device to realize angular adjustment of a wafer received in a reaction chamber via a balance board, the machine adjusting device comprising:
- a plurality of carrying bodies, each of which forms a planar surface at a predetermined location for supporting a predetermined portion of the balance board, the planar surface forming therein a vertical hole, the vertical hole communicating a receiving compartment, each of the carrying bodies having a side surface forming a horizontal hole in communication with the receiving compartment;
- a support post, which is received in the vertical hole;
- a support block, which is received in the receiving compartment and is set in contact engagement with the support post, the support block forming an inner-threaded hole;
- a rod, which is received in the horizontal hole and has an end coupled to the inner-threaded hole;
- and
- a rotary adjustment assembly, which is arranged at one side of each of the carrying bodies, the rotary adjustment assembly being coupled to an end of the rod 5 that is distant from the inner-threaded hole.
Dependencies are inferred from the claim text.