Electro-optical Assembly Fabrication

A computer program product for fabricating an optical assembly, the computer program product comprising:

• a computer readable storage medium having computer readable program code embodied therewith, the computer readable program code comprising;
• first computer readable program code configured to horizontally position a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate;
• second computer readable program code configured to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position;
• third computer readable program code configured to vertically position a flip-chip bonder bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide;
• and
• fourth computer readable program code configured to fixably mount the optical component to the substrate edge.

A computer program product for fabricating an optical assembly, the computer program product comprising:

• a computer readable storage medium having computer readable program code embodied therewith, the computer readable program code comprising;
• first computer readable program code configured to place a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate upon a horizontally movable stage of a flip-chip bonder wherein the stage includes an opening positioned underneath the substrate exposed end edge;
• second computer readable program code configured to vertically upwardly move a clamp through the stage opening to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position;
• third computer readable program code configured to vertically downwardly move a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide;
• fourth computer readable program code configured to fixably mount the optical component to the substrate edge;
• and
• fifth computer readable program code configured to release the optical component from the bond head while moving the clamp vertically downward through the stage opening thereby unbending the flexible portion of the substrate with the optical component mounted thereon.