Electro-optical Assembly Fabrication
AssigneeInternational Business Machines Corporation
InventorsStefano Sergio Oggioni, Jonas R. Weiss, Bert Jan Offrein
Life of this patent
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Abstract
A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
Claims20
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A system for fabricating an optical assembly comprising:
- a horizontally movable stage of a flip-chip bonder including having an opening;
- a substrate including at least one flexible portion and further including a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening;
- a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage;
- a vertically downwardly movable bond head above the stage opening;
- an optical component positioned in the bond head;
- a glue dispenser positioned to provide a glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component;
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- a controller connected to the stage, the clamp, the bond head and the glue dispenser including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.
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Dependencies are inferred from the claim text.