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US 2013/0066581 A1Published application
Integrated circuit testing module including signal shaping interface
AssigneeRambus Inc.
InventorAdrian E. Ong
Life of this patent
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Abstract
Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher slew rate than the slew rate at which signals are received from the automated testing equipment.
Claims1
A test module to couple between a test equipment and a device to be tested, the device comprising an integrated circuit, the integrated circuit comprising:
- first components to communicate with the test equipment at a first frequency, the first components comprising one or more input components configured to receive test signals at the first frequency and to output information derived from the test signals;
- one or more data generating components coupled to receive the information from the first components and configured to generate test data responsive to the information;
- and
- second components to communicate with the device at a second frequency greater than the first frequency, the second components being configured to transmit the test data to the device.
1 more element
Dependencies are inferred from the claim text.