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US 2013/0049191 A1Published application
Semiconductor device and method of manufacturing the same
AssigneeElpida Memory, Inc.
InventorYumiko MIURA
Life of this patent
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Abstract
A semiconductor device has a wiring substrate, a first semiconductor chip, a second semiconductor chip, and a sealing member. The second semiconductor chip has a chip-layered structure with a plurality of semiconductor chip components stacked in the height direction of the semiconductor device. The first semiconductor chip has an upper surface located at the same height from a surface of the wiring substrate as an upper surface of the second semiconductor chip.
Claims20
A semiconductor device comprising:
- a wiring substrate;
- a first semiconductor chip mounted on the wiring substrate;
- a second semiconductor chip mounted on the wiring substrate so that an upper surface of the first semiconductor chip is located at the same height from a surface of the wiring substrate as an upper surface of the second semiconductor chip, the second semiconductor chip having a chip-layered structure with a plurality of semiconductor chip components stacked in a height direction of the semiconductor device;
- and
- a sealing member covering the first semiconductor chip and the second semiconductor.
2 more elements
A semiconductor device comprising:
- a wiring substrate including a first region and a second region;
- a first semiconductor chip mounted over the first region of the wiring substrate;
- a second semiconductor chip including a first surface and a second surface opposed to the first surface, and the second semiconductor chip stacked over the first semiconductor chip so that the second surface faces the first semiconductor chip;
- a third semiconductor chip including a third surface and a fourth surface opposed to the third surface, the third semiconductor chip being mounted over the second region of the wiring substrate so that the fourth surface faces the wiring substrate;
- and
- an insulating layer formed over the wiring substrate to cover the first, second and third semiconductor chips, the insulating layer including an exposed surface facing away from the wiring substrate,
- wherein a distance between the third surface of the third semiconductor chip and the exposed surface of the insulating layer is substantially equal to a distance between the first surface of the second semiconductor chip and the exposed surface of the insulating layer.
4 more elements
A semiconductor device comprising:
- a wiring substrate including a top surface and a plurality of connection pads formed on the top surface, the top surface including a first region and a second region;
- a first semiconductor chip including a first surface and a plurality of first electrodes formed on the first surface, the first semiconductor chip being mounted over the first region of the wiring substrate;
- a second semiconductor chip including a second surface, a third surface opposed to the second surface and a plurality of second electrodes formed on the second surface, the second semiconductor chip being stacked over the first semiconductor chip so that the third surface faces the first semiconductor chip;
- a third semiconductor chip including a fourth surface, a fifth surface opposed to the fourth surface and a plurality of third electrodes formed on the fourth surface, the third semiconductor chip being mounted over the second region of the wiring substrate so that the fifth surface faces the wiring substrate;
- a plurality of first wires electrically coupling the first electrodes of the first semiconductor chip to the connection pads of the wiring substrate;
- a plurality of second wires electrically coupling the second electrodes of the second semiconductor chip to the connection pads of the wiring substrate;
- a plurality of third wires electrically coupling the third electrodes of the third semiconductor chip to the connection pads of the wiring substrate;
- and
- an insulating layer formed over the top surface of the wiring substrate to cover the first semiconductor chip, the second semiconductor chip, third semiconductor chip, the first wires, the second wires and the third wires,
- wherein a height of the fourth surface of the third semiconductor chip from the top surface of the wiring substrate is substantially equal to a height of the second surface of the second semiconductor chip from the top surface of the wiring substrate.
7 more elements
Dependencies are inferred from the claim text.