METHOD OF CUTTING A MOTHER SUBSTRATE [as amended]
OwnerSang-Hyung LIM, Jang-Hwan SHINinventors
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Abstract
A mother substrate cutting apparatus which may include a stationary stage, a moving stage on the stationary stage, the moving stage being configured to move in a first direction, a guide bar on the stationary stage, the guide bar being connected to the stationary stage via posts and configured to extend above the moving stage in a second direction crossing the first direction, a moving unit at the guide bar, the moving unit being configured to move on the guide bar, a lifter on the moving unit, the lifter being configured to move in a third direction that crosses the first direction and the second direction, and a blade on the lifter, the blade being configured to rotate and cut the mother substrate on the moving stage.
Claims8
-13. (canceled)
A method of cutting a mother substrate, the method comprising:
- positioning the mother substrate on a moving stage of a stationary stage;
- positioning a blade at a cutting position above the mother substrate through controlling a moving unit disposed at a guide bar and a lifter disposed at the moving unit, the blade contacting the mother substrate;
- and
- moving the moving stage in a first direction and rotating the blade to cut the mother substrate.
Dependencies are inferred from the claim text.