Loading patent…
AssigneeMitsubishi Chemical Corporation
InventorsHanako KATO, Yutaka Mori, Hiroshi Kobayashi, Tsubasa Tomura
Estimating the term…
To provide a semiconductor device member that is superior in heat resistance, light resistance, film-formation capability and adhesion, and is capable of sealing a semiconductor device and holding a phosphor without causing cracks, peelings and colorings even after used for a long period of time, the weight loss at the time of heating, measured by a predetermined weight-loss at-the-time-of-heating measurement method, is 50 weight % or lower and the ratio of peeling, measured by a predetermined adhesion evaluation method, is 30% or lower, in the semiconductor device member.
A method for producing a curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the method comprising polycondensating a polysiloxane oligomerconsisting only of bifunctional silicon and having a molecular weight of 400 or larger with a silane monomer comprising tri- or more functional silicon or with a polysiloxane oligomer containing tri- or more functional silicon,
A method for producing a curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the method comprising:
A curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the compound comprising a polycondensate obtained by polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger with a silane monomer comprising tri- or more functional silicon or with a polysiloxane oligomer containing tri- or more functional silicon,
A curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the curable organopolysiloxane composition comprising a polycondensate obtained by polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends with a silane monomer comprising tri- or more functional silicon and having an alkoxy group or with a polysiloxane oligomer containing tri- or more functional silicon and having an alkoxy group, wherein the curable organopolysiloxane composition has a ratio represented by {(the number of alkoxy groups)/(the number of silanols+the number of alkoxy groups)}×100(%) of 0% or more and 50% or less.
Dependencies are inferred from the claim text.