Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
AssigneeSemtech Corporation
InventorsVictor H. Cruz, David Francis Courtney
Life of this patent
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Abstract
A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.
Claims26
The method for making a packaged semiconductor device comprising:
- providing a metal plated pad, leadframe having at least one package site, the at least one package site having at least one lead;
- mounting a semiconductor die on the at least one package site using a metal braze;
- bonding a connector to the semiconductor die and the at least one lead using a metal braze;
- and
- encapsulating and sealing the semiconductor die, the connector and at least part of the pad, leadframe and the at least one lead with in a glass ceramic compound to form a hermetically sealed electronic package, and
- wherein the metal braze, metal pad, leadframe and glass ceramic are thermally matched and wherein the glass ceramic has a CTE<5.0×10−6 and a transition temperature >450° C.
A high temperature, non-cavity package for non-axial electronics comprising:
- a lead frame comprising a die pad and at least one lead extending therefrom;
- at least one semiconductor die, the semiconductor die bonded to the pad, lead frame with a metal braze;
- a connector adapted provide electrical interconnections between the at least one lead and the at least one semiconductor die, the connector bonded to the die and the pad, lead frame with a metal braze;
- and
- a glass ceramic compound encapsulating the at least one semiconductor die, the die pad, the connector and a portion of the at least one lead.
Dependencies are inferred from the claim text.