Techniques Providing Semiconductor Wafer Grouping In A Feed Forward Process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsun-Jen Chan, Yh-Hsiu Hsiao, Lu Cheng-Ta, Jian-Hong Wu
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Abstract
A method for processing a plurality of semiconductor wafers includes acquiring a process parameter measurement for each of the semiconductor wafers, associating each of the semiconductor wafers with one of a plurality of groups based on a respective process parameter measurement for each of the semiconductor wafers, where each respective group corresponds to a respective recipe, and for each one of the groups, processing ones of the semiconductor wafers associated with that group together according to a respective recipe.
Claims20
A method for processing a plurality of semiconductor wafers, the method comprising:
- acquiring a process parameter measurement for each of the semiconductor wafers;
- associating each of the semiconductor wafers with one of a plurality of groups based on a respective process parameter measurement for each of the semiconductor wafers, where each respective group corresponds to a respective recipe;
- and
- for each one of the groups, processing ones of the semiconductor wafers associated with that group together according to a respective recipe.
A method for manufacturing a plurality of semiconductor wafers, the method comprising:
- receiving a batch of semiconductor wafers;
- generating process parameter data for each of the semiconductor wafers, the process parameter data for a respective semiconductor wafer indicating a process condition in a subsequent step for the respective semiconductor wafer;
- dividing the batch into a plurality of groups, each one of the groups including ones of the semiconductor wafers associated with a same process condition;
- and
- processing the batch group-by-group in the subsequent step.
A computer program product having a computer readable medium tangibly recording computer program logic for controlling a semiconductor manufacturing process, the computer program product comprising:
- code to analyze process parameter data for each of a plurality of semiconductor wafers;
- code to associate each of the semiconductor wafers with a respective one of a plurality of groups, where each respective one of the groups is associated with a different recipe in a subsequent processing step;
- and
- code to process the semiconductor wafers in the subsequent processing step group-by-group.
Dependencies are inferred from the claim text.