Cooling apparatus and cooling method
AssigneeSumitomo Bakelite Co., Ltd.
InventorsShigehisa Ueda, Hiroshi Shibata
Life of this patent
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Abstract
A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of −40 to 0° C. to the resin composition.
Claims16
A cooling apparatus comprising:
- a conveying means which conveys a resin composition molded into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition;
- and
- a cooling means which cools the resin composition being conveyed by the conveying means,
- wherein a temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C., and
- wherein the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min.
A cooling method for cooling a resin composition molded into a sheet shape while conveying the resin composition along a direction parallel to a surface of the sheet-shaped resin composition,
- wherein a temperature of the resin composition just before being cooled by the cooling method is in the range of 40 to 60° C., and
- wherein the resin composition is cooled such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min.
Dependencies are inferred from the claim text.