Heat-Resistant Adhesive

Abstract

Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005≦n/(m+n)<1, and m+n is an integer which is more than 0 but equal to or less than 200, Ar1 represents a divalent aromatic group, Ar2 represents a divalent aromatic group having a phenolic hydroxy group, and Ar3 represents a divalent aromatic group), an epoxy resin (B), a curing catalyst (C), an inorganic filler (D), and an epoxy resin curing agent other than the component (A) as an optional component, in which the amount of the component (D) contained therein relative to 100 parts by mass of the total amount of the components (A) to (C) and the epoxy resin curing agent as the optional component is 30 to 950 parts by mass. A cured layer of the adhesive when an electric circuit or the like and a radiator plate are adhered to each other with the adhesive followed by curing the adhesive not only has high heat resistance and high adhesiveness, but also has high thermal conductivity, and also has excellent long-lasting insulation properties. Further, the cured adhesive is flame retardant, and therefore, the adhesive is very useful as a high-functional semiconductor peripheral material.

Dependencies are inferred from the claim text.