Device and process for liquid treatment of wafer shaped articles
AssigneeLam Research Corporation
InventorsMichael PUGGL, Christian AUFEGGER, Karl-Heinz HOHENWARTER
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AssigneeLam Research Corporation
InventorsMichael PUGGL, Christian AUFEGGER, Karl-Heinz HOHENWARTER
Estimating the term…
A spin chuck and a process of operating the same display improved resistance to backsplash by provision of a media collecting ring mounted on the spin chuck. The media collecting ring surrounds a wafer to be processed and includes a radially-inwardly extending upper portion having an obliquely-angled downwardly-facing surface positioned above an upper surface of a wafer held in the device. The device moreover includes a stationary chamber surrounding the spin chuck equipped with at least two superposed collecting baffles. During treatment, liquid collected by the media collecting ring is preferably discharged radially outwardly through a series of holes formed in the ring, so as to pass between a pair of the superposed collecting baffles of the chamber.
A device for liquid treatment of a wafer-shaped article, comprising a spin chuck adapted to hold a wafer-shaped article in a predetermined orientation and to spin the wafer-shaped article about an axis perpendicular to a major surface of the wafer-shaped article;
A process for liquid treatment of a wafer-shaped article, comprising positioning a wafer-shaped article on a spin chuck in a predetermined orientation;
Dependencies are inferred from the claim text.