Patterning
AssigneeCambridge Enterprise Limited
InventorsHenning Sirringhaus, Jui-Fen Chang, Michael Gwinner
Life of this patent
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Abstract
The present invention provides a method of patterning an electronic or photonic material on a substrate comprising: forming a film (polymer A) of said electronic or photonic material on said substrate; and using a fluoropolymer (e.g. cytop) to protect regions of said electronic or photonic material during a patterning process.
Claims51
A method of patterning an electronic or photonic material on a substrate comprising:
- forming a film of said electronic or photonic material on said substrate;
- and
- using a fluoropolymer to protect regions of said electronic or photonic material during a patterning process.
(canceled)
A method of making an electronic device on a substrate comprising:
- forming a film of an organic semi conductor material on said substrate;
- patterning said film of organic semi conductor material by using a protective polymer to protect regions of said organic semi conductor material during the patterning process;
- and
- removing the protective polymer that remains after patterning,
- wherein, in operation, said electronic device utilises current flow through the surface of said organic semi conductor material which is in contact with the protective layer during patterning.
(canceled)
A method of patterning at least a first electronic or photonic material and a second electronic or photonic material on a substrate comprising:
- (A) patterning said first electronic or photonic material on a substrate by a method comprising:
- forming a film of said first electronic or photonic material on said substrate;
- and
- using a protective polymer to protect regions of said electronic or photonic material during a patterning process;
- and
- (B) patterning said second electronic or photonic material by a method comprising:
- forming a film of said second electronic or photonic material on the pattern resulting from step (A);
- and
- selectively removing those regions of second electronic or photonic material having underlying protective polymer.
A method of patterning at least a first electronic or photonic material and a second electronic or photonic material on a substrate comprising:
- (a) patterning said first electronic or photonic material on a substrate by a method comprising:
- forming a film of said first electronic or photonic material on said substrate;
- and
- using a protective polymer to protect regions of said electronic or photonic material during a patterning process;
- (b) depositing a further layer of protective polymer on said pattern of first electronic or photonic material and patterning said protective polymer;
- and
- (c) forming a film of said second electronic or photonic material on the pattern resulting from step (b);
- and
- (d) selectively removing those regions of second electronic or photonic material having underlying protective polymer.
(canceled)
41-45. (canceled)
An electronic or photonic device comprising:
- a substrate;
- a first pattern comprising a first solution-processed organic semi conductor material;
- a second pattern comprising a second solution-processed organic semi conductor material;
- wherein said patterns of said first and second organic semi conductor materials form a lateral heterojunction and
- wherein, in operation, an electrical current is flowing between said patterns of first organic semi conductor and second organic semi conductor across said lateral heterojunction.
An electronic or photonic device comprising:
- a substrate;
- a first pattern comprising a first solution-processed organic semi conductor material;
- a second pattern comprising a second solution-processed organic semi conductor material;
- and
- wherein said patterns of said first and second organic semi conductor materials are not in physical contact.
Dependencies are inferred from the claim text.