Electroconductive paste for electron beam curing and circuit board production method using same
AssigneesGoo Chemical Co., Ltd., Fujikura Ltd.
InventorsKazutoshi Koshimizu, Shigeo Ota
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Abstract
The present invention provides an electroconductive paste for electron beam curing that allows the formation of a circuit board having an electroconductive layer that has superior hardness and bendability as well as superior adhesion to a plastic base even if used in a high-temperature environment. The present invention is an electroconductive paste for electron beam curing comprising an electroconductive powder, a radical polymerizable composition and a plasticizer, wherein the plasticizer is incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.
Claims10
An electroconductive paste for electron beam curing, comprising:
- an electroconductive powder;
- a radical polymerizable composition;
- and
- a plasticizer, wherein
- the plasticizer is incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.
A method for producing a circuit board provided with a plastic base and an electroconductive layer provided on the plastic base,
- the method comprising:
- a step of coating an electroconductive paste for electron beam curing on the plastic base, and
- a step of obtaining the circuit board by curing the electroconductive paste for electron beam curing by irradiating with an electron beam to form the electroconductive layer,
- wherein the electroconductive paste comprises:
- an electroconductive powder;
- a radical polymerizable composition;
- and
- a plasticizer, the plasticizer being incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.
Dependencies are inferred from the claim text.