Threaded structures with solder management features

Abstract

Threaded structures such as threaded standoff structures may be provided with features that control the flow of solder. A base structure for a standoff may be formed from a material such as metal. During attachment of the standoff to a substrate such as a printed circuit board, the base structure may be exposed to molten solder. A solderphilic coating may be provided on the outer surface of the standoff to encourage wicking of solder up and over lower portions of the standoff and beneath the standoff, thereby helping to secure the standoff to the substrate. The center of the base structure may be provided with threads to receive screws. To prevent solder from covering the threads, the surface of the threads may be provided with a solderphobic surface.

Dependencies are inferred from the claim text.