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US 2012/0269489 A1Published application
Dram package, dram module including dram package, graphic module including dram package and multimedia device including dram package
OwnerSungjoo PARK, InDal SONG +2inventors
InventorsSungjoo PARK, InDal SONG, Jangseok CHOI, Yong-Jin KIM
Life of this patent
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Abstract
A DRAM package includes a DRAM package body, and a ball grid array formed at a lower surface of the DRAM package body. The ball grid array includes a plurality of solder balls arranged in the equal interval along row and column directions. The DRAM package is included in an electronic apparatus.
Claims43
A DRAM package comprising:
- a DRAM package body;
- and
- a ball grid array formed at a lower surface of the DRAM package body, the ball grid array including a plurality of solder balls arranged at an equal interval along row and column directions thereof.
A DRAM module comprising:
- a plurality of DRAM packages provided on an upper surface of a printed circuit board;
- and
- a connector formed at one side of the printed circuit board and electrically connected with the plurality of DRAM packages,
- wherein each of the plurality of DRAM packages is connected with the printed circuit board via a ball grid array, and the ball grid array includes a plurality of solder balls arranged at an equal interval along a row direction and arranged at the equal interval along a column direction.
1 more element
A graphic module comprising:
- a graphic processor unit provided on a printed circuit board;
- and
- at least one DRAM package electrically connected with the graphic processor unit,
- wherein the at least one DRAM package is connected with the printed circuit board via a ball grid array, and the ball grid array includes a plurality of solder balls arranged at an equal interval along a row direction and arranged at the equal interval along a column direction.
1 more element
A multimedia device comprising:
- a processor;
- a DRAM package, an audio unit, a modem unit, a storage unit, a graphic unit, an interface unit, and an image processor unit configured to operate according to a control of the processor;
- a speaker configured to communicate with the audio unit;
- a user input interface configured to operate according to a control of the interface unit;
- a camera configured to operate according to a control of the image processor unit;
- and
- a monitor configured to operate according to a control of the graphic unit,
- wherein the DRAM package is connected with a printed circuit board via a ball grid array, and the ball grid array includes a plurality of solder balls arranged at an equal interval along a row direction and arranged at the equal interval along a column direction.
5 more elements
An electronic apparatus comprising:
- a circuit board provided with a function unit configured to perform an operation of the electronic apparatus using data, and formed with pads thereon;
- and
- at least one semiconductor package electrically connected with the function unit to store at least one of the data and the processed data, and formed with a ball grid array to be connected to the respective pads of the circuit board, the ball grid array including a plurality of solder balls arranged at an equal interval along a row direction and arranged at the equal interval along a column direction to correspond to the respective pads.
A semiconductor package comprising:
- a semiconductor package body formed with one or more semiconductor chips;
- and
- a ball grid array formed at a lower surface of the semiconductor package body, the ball grid array including a plurality of solder balls disposed in an area of the lower surface of the semiconductor package body and arranged at a same interval along row and column directions thereof.
An electronic apparatus comprising:
- a circuit board having a function unit and a pad array having pads;
- and
- a semiconductor package comprising:
- a semiconductor package body formed with one or more semiconductor chips;
- and
- a ball grid array formed at a lower surface of the semiconductor package body, the ball grid array including a plurality of solder balls disposed in an area of the lower surface of the semiconductor package body and arranged at a same interval along row and column directions thereof to correspond to the respective pads of the pad array.
3 more elements
Dependencies are inferred from the claim text.