Light-emitting module

A light-emitting module, comprising:

• a heat-dissipating structure;
• a multichip package structure disposed on the heat-dissipating structure,
• wherein the multichip package structure comprises:
• a substrate unit including a substrate body, a first chip-placing region formed on the top surface of the substrate body, and a second chip-placing region formed on the top surface of the substrate body;
• a light-emitting unit including at least one first light-emitting module and at least one second light-emitting module, wherein the at least one first light-emitting module includes a plurality of first LED bare chips disposed on the first chip-placing region and electrically connected to the substrate body, and the at least one second light-emitting module includes a plurality of second LED bare chips disposed on the second chip-placing region and electrically connected to the substrate body;
• a frame unit including at least one first surrounding light-reflecting colloid body and at least one second surrounding light-reflecting colloid body surroundingly coated on the top surface of the substrate body, wherein the at least one first surrounding light-reflecting colloid body surrounds the at least one first light-emitting module to form at least one first colloid position limiting space on the first chip-placing region, and the at least one second surrounding light-reflecting colloid body surrounds the at least one second light-emitting module and the at least one first surrounding light-reflecting colloid body to form at least one second colloid position limiting space on the second chip-placing region and between the at least one first surrounding light-reflecting colloid body and the at least one second surrounding light-reflecting colloid body;
• and
• a package unit including a first light-transmitting colloid body and a second light-transmitting colloid body disposed on the top surface of the substrate body to respectively cover the at least one first light-emitting module and the at least one second light-emitting module, wherein the first light-transmitting colloid body and the second light-transmitting colloid body are respectively disposed in the at least one first colloid position limiting space and the at least one second colloid position limiting space;
• and
• a protection cover structure disposed on the heat-dissipating structure to cover and protect the multichip package structure, wherein the protection cover structure has an opening for exposing the package unit.