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US 2012/0268928 A1Published application
Large single chip led device for high intensity packing
OwnerRobert L. Sargentinventor
Life of this patent
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Abstract
A LED chip device comprises an electrically conductive base overlain by a dielectric layer. A recess in the dielectric exposes the base. A LED is mounted on the base in the recess such that the LED is substantially flush with a side of the base. The LED is electrically connected to pads disposed on the dielectric layer on opposing sides of the LED and the pads are electrically connected to each other.
Claims20
An LED carrier, comprising:
- an electrically conductive base with first and second base sides;
- a dielectric layer disposed over a surface of said base, a recessed area extending through said dielectric layer exposing said base;
- a pair of electrically conductive contact pads disposed over said dielectric layer, one of said contact pads electrically connected to the other of said contact pads;
- a LED (light emitting diode) disposed within said recessed area and contacting said base, one edge of said LED substantially flush with said first side of said base;
- and
- a plurality of electrical connections connecting said LED to each of said contact pads.
3 more elements
A method of emitting electromagnetic radiation from an LED (light emitting diode), said LED comprising an electrically conductive base with first and second base sides;
- a dielectric layer disposed over a surface of said base, a recessed area extending through said dielectric layer exposing said base;
- a pair of electrically conductive contact pads disposed over said dielectric layer, one of said contact pads electrically connected to the other of said contact pads;
- a LED disposed within said recessed area and contacting said base, one edge of said LED substantially flush with said first side of said base;
- and a plurality of electrical connections connecting said LED to each of said contact pads;
- said method comprising passing an electric current through said LED.
2 more elements
A method of manufacturing a LED carrier, comprising,
- contacting an LED (light emitting diode) to an electrically conductive base at a recess a dielectric layer overlaying said base such that said LED is substantially flush with a first edge of said base;
- and
- connecting bonds between said LED and a wire pad and between said LED and a contact pad, wherein said wire pad and said contact pad are electrically connected.
Dependencies are inferred from the claim text.