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US 2012/0268909 A1Published application
Enhanced Modularity in Heterogeneous 3D Stacks
AssigneeInternational Business Machines Corporation
InventorsPhilip G. Emma, Eren Kursun, Jude A. Rivers
Life of this patent
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Abstract
A three-dimensional computer processing chip stack that includes a host layer disposed on at least one other layer in the stack. The host layer includes cavities formed thereon for receiving chips pre-configured with heterogeneous properties relative to each other. The cavities are formed to accommodate the heterogeneous properties of the chips. The chips are joined to respective surfaces of the cavities, thereby forming an element having a smooth surface with respect to the host layer and the chips.
Claims20
A three-dimensional computer processing chip stack, comprising:
- a host layer disposed on at least one other layer in the stack, the host layer including cavities formed thereon for receiving chips pre-configured with heterogeneous properties relative to each other, the cavities formed to accommodate the heterogeneous properties of the chips;
- wherein the chips are joined to respective surfaces of the cavities thereby forming an element having a smooth surface with respect to the host layer and the chips.
Dependencies are inferred from the claim text.