Lithography system for processing a target, such as a wafer, and a method for operating a lithography system for processing a target, such as a wafer
AssigneeMapper Lithography IP B.V.
InventorsGuido De Boer, Niels Vergeer, Godelridus Cornelius Antonius Couweleers, Laurens Plandsoen, Cor Verburg
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Abstract
The invention relates to a lithography system for processing a target, such as a wafer. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system connected to the final projection system and arranged for detecting a position mark on a surface.
Claims19
Lithography system for processing a target, such as a wafer, the target comprising a target surface, the lithography system comprising
- a beam source arranged for providing a patterning beam, preferably light beam or a charged particle beam, such as an electron beam, the beam preferably comprising at least two beamlets;
- a final projection system arranged for projecting a pattern on the target surface with said patterning beam;
- a chuck arranged for supporting the target, wherein the chuck comprises a beam measurement sensor and a chuck surface provided with at least one chuck position mark thereon, the beam measurement sensor being arranged for measuring beam properties of the patterning beam, the beam properties comprising a spatial distribution of an intensity of the patterning beam and/or preferably a spatial distribution of the at least two beamlets;
- an actuator system arranged for moving the chuck in at least one dimension with respect to the final projection system;
- a chuck position sensor system, arranged for measuring the position of the chuck with respect to the final projection system in chuck position coordinates;
- and,
- a mark position system connected to the final projection system and arranged for detecting a position mark on a surface, such as the at least one chuck position mark on the chuck surface.
Method for operating a lithography system for processing a target, such as a wafer, said method comprising:
- during an initialization phase:
- a1) providing a chuck, the chuck comprising a beam measurement sensor and a chuck surface, the chuck surface provided with at least one chuck position mark thereon, wherein the chuck is moveable in chuck coordinates;
- a2) determining a position of the at least one chuck position mark in chuck coordinates;
- a3) providing a patterning beam, preferably comprising at least two beamlets;
- a4) measuring beam properties of the patterning beam, the beam properties comprising a spatial distribution of an intensity of the patterning beam;
- and/or preferably a spatial distribution of the at least two beamlets;
- a5) determining a spatial distribution of beam properties in chuck coordinates;
- a6) determining a spatial distribution of beam properties with respect to the position of the at least one chuck position mark.
Dependencies are inferred from the claim text.