Pad controlling apparatus
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYong Il Kwon, Han Jin Cho, Tah Joon Park, Koon Shik Cho
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Abstract
Disclosed herein is a pad controlling apparatus controlling current and voltage applied to a pad, the pad controlling apparatus including: a voltage drop unit dropping the voltage applied to the pad; a switching unit connected in parallel with the voltage drop unit; and a control unit comparing a level of the dropped voltage and first reference voltage with each other and turning on the switching unit on when the level of the dropped voltage is larger than the first reference voltage. According to the present invention, even though interrupt occurs from the outside, a chip may be normally operated.
Claims11
A pad controlling apparatus controlling current and voltage applied to a pad, the pad controlling apparatus comprising:
- a voltage drop unit dropping the voltage applied to the pad;
- a switching unit connected in parallel with the voltage drop unit;
- and
- a control unit comparing a level of the dropped voltage and first reference voltage with each other and turning on the switching unit on when the level of the dropped voltage is larger than the first reference voltage.
A pad controlling apparatus controlling current and voltage applied to a pad, the pad controlling apparatus comprising:
- a voltage drop unit dropping the voltage applied to the pad;
- a switching unit connected in parallel with the voltage drop unit;
- and
- a control unit turning on the switching unit when the voltage dropped and applied to the pad is smaller than second reference voltage.
Dependencies are inferred from the claim text.