Automated loading/unloading of devices for burn-in testing

A method comprising:

• stacking boards in a carrier at a load/unload station with semiconductor devices loaded into each board, the carrier for supporting a plurality of boards in a stacked array;
• transporting the carrier and boards with a trolley to a burn-in oven;
• placing the carrier and boards into the burn-in oven with an electrical contact on each board abutting an electrical connector of the burn-in oven;
• and
• inserting the electrical contacts into the electrical connectors by a mechanism of a door of the burn-in oven.

A method comprising:

• stacking boards in a carrier at a load/unload station with semiconductor devices loaded into each board, the carrier for supporting a plurality of boards in a stacked array;
• transporting the carrier and boards to a burn-in oven;
• placing the carrier and boards into the burn-in oven with electrical contacts on each board abutting electrical connectors of the burn-in oven;
• and
• engaging the electrical contacts with the electrical connectors by a mechanism of a door of the burn-in oven, the mechanism is pneumatically actuated.