Modular Array and Circuits for Ultrasound Transducers

An ultrasound transducer probe comprising:

• a multi-dimensional array of ultrasound transducer elements, the ultrasound transducer elements distributed in azimuth and elevation;
• a plurality of frames positioned adjacent to each other such that a surface formed from the frames supports all of the multi-dimensional array, the frames each extending substantially perpendicularly from the multi-dimensional array and away from the surface;
• a plurality of circuits connected with respective frames such that the circuits are perpendicular to the multi-dimensional array;
• and
• flexible circuit material for each frame extending from the circuit or circuits and over the surface between the multi-dimensional array and the frames, traces of the flexible circuit material over the surface connecting with the ultrasound transducer elements.

A method for stacking an ultrasound probe, the method comprising:

• for each of a plurality of frames, connecting one or more application specific integrated circuits;
• for each of the frames, connecting traces on flexible material to the circuits;
• stacking the frames adjacent to each other;
• placing a multi-dimensional transducer array on the stack of frames such that the circuits are substantially perpendicular to the multi-dimensional transducer array;
• and
• electrically connecting the traces to the multi-dimensional transducer array such that a first two-dimensional pitch of the traces connected to the circuits is different than a second two-dimensional pitch of the traces electrically connected to the multi-dimensional transducer array.