Multiple die face-down stacking for two or more die

A microelectronic assembly, comprising:

• a substrate having opposed first and second surfaces each extending in a first direction and in a second direction transverse to the first direction, at least one first opening extending between the first and second surfaces, and at least one second opening extending between the first and second surfaces;
• a first microelectronic element having a front surface facing the first surface of the substrate, the first microelectronic element having a rear surface opposite the front surface and an edge extending between the front and rear surfaces and extending in the second direction, and the first microelectronic element having at least one row of five or more bond pads extending in the first direction along the front surface of the first microelectronic element aligned with the at least one first opening;
• and
• a second microelectronic element having a front surface facing the rear surface of the first microelectronic element, the front surface of the second microelectronic element having first and second opposed edges, the front surface of the second microelectronic element projecting in the first direction beyond the edge of the first microelectronic element, and having a first outer region adjacent the first edge, a second outer region adjacent the second edge, and a central region disposed between the first and second outer regions, each of the first and second outer regions and the central region having equal width such that the central region extends a middle third of a distance between the first and second edges,
• the second microelectronic element further having at least one row of five or more bond pads extending in the second direction along the front surface of the second microelectronic element and disposed in the central region and aligned with the at least one second opening,
• wherein the bond pads of the first and second microelectronic elements are electrically connected to conductive elements of the substrate.