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US 2012/0267790 A1Published application
Semiconductor integrated circuit
AssigneeHynix Semiconductor Inc.
InventorsKang-Seol LEE, Jae-Jin LEE, Jae-Hyuk IM
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Abstract
A semiconductor integrated circuit includes a semiconductor chip, a plurality of first through-chip vias formed vertically through the semiconductor chip and configured to operate as an interface for a first power supply, and a first common conductive layer provided over the semiconductor chip and coupling the plurality of first through-chip vias to each other in a horizontal direction.
Claims20
A semiconductor integrated circuit comprising:
- a semiconductor chip;
- a plurality of first through-chip vias formed vertically through the semiconductor chip and configured to operate as an interface for a first power supply;
- and
- a first common conductive layer provided over the semiconductor chip and coupling the plurality of first through-chip vias to each other in a horizontal direction.
1 more element
A semiconductor integrated circuit comprising:
- a plurality of semiconductor chips stacked in a vertical direction;
- a plurality of first through-chip vias formed vertically through the plurality of semiconductor chips and configured to operate as an interface for a first power supply;
- and
- a first common conductive layer provided over a semiconductor chip stacked at the uppermost position among the plurality of stacked semiconductor chips and coupling the plurality of first through-chip vias to each other in a horizontal direction.
1 more element
A semiconductor integrated circuit comprising:
- a plurality of semiconductor chips stacked in a vertical direction;
- a plurality of first through-chip vias formed vertically through the plurality of semiconductor chips at a plurality of first positions corresponding to the first through-chip vias, respectively, and configured to operate as an interface for a first power supply;
- a first common conductive layer provided over a semiconductor is chip stacked at the uppermost position among the plurality of semiconductor chips and coupling the plurality of first through-chip vias to each other in a horizontal direction;
- a plurality of second through-chip vias formed vertically through the plurality of semiconductor chips at a plurality of second positions corresponding to the second through-chip vias, respectively, and configured to operate as an interface for a second power supply;
- and
- a plurality of coupling pads arranged in a same layer as the first common conductive layer and coupled to the second through-chip vias, respectively.
3 more elements
Dependencies are inferred from the claim text.