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US 2012/0267784 A1Published application
Semiconductor Device and Bonding Wire
AssigneeInfineon Technologies AG
InventorsKhalil Hosseini, Manfred Mengel, Joachim Mahler
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip, a contact pad of the semiconductor chip and a first layer arranged over the contact pad. The first layer includes niobium, tantalum or an alloy including niobium and tantalum.
Claims25
A semiconductor device, comprising:
- a semiconductor chip;
- a contact pad of the semiconductor chip;
- and
- a first layer overlying the contact pad, the first layer comprises a material selected from the group consisting of niobium, tantalum and an alloy comprising niobium and tantalum.
1 more element
A semiconductor device, comprising:
- a semiconductor chip comprising an active surface;
- a metal layer overlying an opposite surface of the semiconductor chip, the opposite surface opposite the active surface;
- and
- a second layer overlying the metal layer, the second layer comprises a metal selected from the group consisting of niobium, tantalum and an alloy comprising niobium and tantalum.
1 more element
A semiconductor device, comprising:
- a semiconductor chip comprising a first surface and a second surface opposite the first surface;
- a contact pad of the semiconductor chip overlying the first surface;
- a first layer overlying the contact pad;
- a metal layer overlying the second surface;
- and
- a second layer overlying the metal layer, wherein the first and the second layer each comprises a material selected from the group consisting of niobium, tantalum and an alloy comprising niobium and tantalum.
3 more elements
A bonding wire, comprising:
- a wire core;
- and
- a coating material arranged over the wire core, the coating material comprising a material selected from the group consisting of niobium, tantalum and an alloy comprising niobium and tantalum.
A method of manufacturing a bonding wire, the method comprising:
- providing a wire core;
- and
- coating the wire core with a coating material, the coating material comprising a material selected from the group consisting of niobium, tantalum and an alloy comprising niobium and tantalum.
Dependencies are inferred from the claim text.