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US 2012/0267780 A1Published application
Chip package and method for forming the same
OwnerBing-Siang CHEN, Chien-Hui CHEN +3inventors
InventorsBing-Siang CHEN, Chien-Hui CHEN, Shu-Ming CHANG, Tsang-Yu LIU, Yen-Shih HO
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Abstract
An embodiment of the invention provides a chip package which includes: a first chip; a second chip disposed on the first chip, wherein a side surface of the second chip is a chemically-etched surface; and a bonding bulk disposed between the first chip and the second chip such that the first chip and the second chip are bonded with each other.
Claims20
A chip package, comprising:
- a first chip;
- a second chip disposed on the first chip, wherein a side surface of the second chip is a chemically-etched surface;
- and
- a bonding bulk disposed between the first chip and the second chip such that the first chip and the second chip are bonded with each other.
1 more element
A method for forming a chip package, comprising:
- providing a first substrate;
- providing a second substrate;
- forming at least a bonding bulk on an upper surface of the first substrate and/or on a lower surface of the second substrate;
- bonding the second substrate onto the first substrate through the bonding bulk;
- forming a first protection layer on an upper surface of the second substrate, wherein the first protection layer has an opening exposing a predetermined scribe region of the second substrate;
- using the first protection layer as a mask to etch and remove a portion of the second substrate located in the predetermined scribe region to form a through-hole exposing the first substrate;
- and
- partially removing the first substrate exposed by the through-hole to form at least one chip package.
5 more elements
Dependencies are inferred from the claim text.