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US 2012/0267779 A1Published application
Semiconductor package
AssigneeMediatek Inc.
InventorsTzu-Hung LIN, Wen-Sung HSU, Tai-Yu CHEN
Life of this patent
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Abstract
The invention provides a semiconductor package. The semiconductor package includes a semiconductor die having a central area and a peripheral area surrounding the central area. A first conductive bump is disposed on the semiconductor die in the central area. A second conductive bump is disposed on the semiconductor die in the peripheral area. An area ratio of the first conductive bump to the second conductive bump from a top view is larger than 1, and less than or equal to 3.
Claims18
A semiconductor package, comprising:
- a semiconductor die;
- and
- a first conductive bump and a second conductive bump respectively disposed on the semiconductor die, wherein an area ratio of the first conductive bump to the second conductive bump from a top view is larger than 1, and less than or equal to 3.
Dependencies are inferred from the claim text.