Chip stack package
AssigneeNanya Technology Corporation
InventorShu-Liang Nin
Life of this patent
Estimating the term…
Abstract
A chip stack package is provided. The chip stack package includes an n number of chips stacked on each other and an n number of interconnection strands connecting the chips. The interconnection strands are spirally rotated and insulated from each other. In one embodiment, the chips are substantially structurally identical. In another embodiment, each of the interconnection strands is electrically coupled to a chip selection signal.
Claims17
A chip stack package, comprising:
- an n-number of chips stacked on each other;
- and
- an n-number of electrical interconnection strands electrically connecting the chips, wherein the electrical interconnection strands are spirally rotated and insulated from each other.
A chip stack package comprising a DNA-like interconnection structure between a plurality of packaged chips, wherein the DNA-like interconnection structure comprises spiral, electrical interconnection strands constructed by metal layers in or on each chip and the through-silicon vias (TSVs) for the connection between the chips.
Dependencies are inferred from the claim text.