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US 2012/0267774 A1Published application
Method of manufacturing a semiconductor device and semiconductor device
AssigneeInfineon Technologies AG
InventorsHenrik Ewe, Joachim Mahler, Anton Prueckl
Life of this patent
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Abstract
One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules includes a carrier and at least one semiconductor chip attached to the carrier. A dielectric layer is applied to the modules to form a workpiece. The dielectric layer is structured to open at least one of the semiconductor chips. The workpiece is singulated to obtain a plurality of devices.
Claims22
A method of manufacturing a device, comprising:
- providing a first carrier and a second carrier that are not connected to each other;
- attaching a first semiconductor chip to the first carrier;
- attaching a second semiconductor chip to the second carrier;
- laminating a dielectric layer on the first semiconductor chip and the second semiconductor chip;
- structuring the dielectric layer open to at least the first semiconductor chip;
- and
- separating the first carrier and the second carrier by dividing the dielectric layer.
4 more elements
A device comprising:
- a ceramic carrier;
- a metal layer placed over the ceramic carrier;
- a semiconductor chip comprising a first electrode on a first face and a second electrode on a second face opposite to the first face, the semiconductor chip placed over the metal layer with its first face facing the metal layer;
- a dielectric layer placed over the semiconductor chip;
- and
- an external contact element electrically coupled to the semiconductor chip and placed over the dielectric layer.
3 more elements
A method of manufacturing a device, comprising:
- providing a first carrier and a second carrier that are not connected to each other;
- attaching a first semiconductor chip to the first carrier to form a first module;
- attaching a second semiconductor chip to the second carrier to form a second module;
- forming a dielectric layer on the first semiconductor chip and the second semiconductor chip;
- structuring the dielectric layer open to at least the first semiconductor chip;
- and
- separating the first carrier and the second carrier by dividing the dielectric layer.
4 more elements
Dependencies are inferred from the claim text.