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US 2012/0267772 A1Published application
Semiconductor device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorAtsushi FUJISAWA
Life of this patent
Estimating the term…
Abstract
To provide a semiconductor device having suspension leads with less distortion. In QFN having a plurality of external terminal portions at the periphery of the bottom surface of a sealing body, a plurality of leads is linked to a plurality of long suspension leads of the QFN at an intermediate portion thereof or at between the intermediate portion and a position near the die pad. These long suspension leads are each supported by these leads, making it possible to suppress distortion of each of the suspension leads in a wire bonding step or molding step in the fabrication of the QFN.
Claims16
A method of manufacturing a semiconductor device comprising the steps of:
- (a) providing a lead frame having a die pad, a plurality of suspension leads supporting the die pad, a plurality of first leads spaced apart from the die pad and arranged adjacent to the die pad, and a plurality of second leads spaced apart from the die pad and supporting the suspension leads;
- (b) after the step (a), mounting, over an upper surface of the die pad, a semiconductor chip having a front surface, a plurality of bonding pads formed over the front surface, and a rear surface opposite to the front surface such that the rear surface faces to the upper surface of the die pad;
- (c) after the step (b), electrically connecting the bonding pads with the first leads via a plurality of wires, respectively;
- and
- (d) after the step (c), placing the lead frame having the semiconductor chip thereon between a first molding die having a recessed portion and a second molding die faces to the first molding die, clamping a portion of each of the suspension leads, a portion of each of the first leads, and a portion of each of the second leads with the first molding die and the second molding die, supplying a resin into the recessed portion so as to seal the semiconductor chip and the wires with the resin such that a lower surface of the die pad opposite to the upper surface, the portion of each of the suspension leads, the portion of each of the first leads and the portion of each of the second leads are exposed, and thereby forming a sealing body,
- wherein a shape in a plan view of the sealing body is comprised of quadrangle;
- wherein the suspension leads extend from the die pad to a plurality of corner portions of the sealing body, in the plan view;
- wherein each of the suspension leads has one end portion connected to the die pad, the other end portion opposite to the one end portion, and an intermediate portion located between the one end portion and the other end portion, and
- wherein some of the second leads are connected at the intermediate portion of each of the suspension leads, or at the die pad side of each of the suspension leads from the intermediate portion.
6 more elements
A method of manufacturing a semiconductor device comprising the steps of:
- (a) providing a lead frame having a die pad, a plurality of suspension leads supporting the die pad, a plurality of first leads spaced apart from the die pad and arranged adjacent to the die pad, and a plurality of second leads spaced apart from the die pad and supporting the suspension leads;
- (b) after the step (a), mounting, over an upper surface of the die pad, a semiconductor chip having a front surface, a plurality of bonding pads formed over the front surface, and a rear surface opposite to the front surface such that the rear surface faces to the upper surface of the die pad;
- (c) after the step (b), placing the lead frame having the semiconductor chip thereon over a stage, clamping a portion of each of the suspension leads, a portion of each of the first leads, and a portion of each of the second leads with a jig and the stage, and electrically connecting the bonding pads with the first leads via a plurality of wires, respectively;
- and
- (d) after the step (c), sealing the semiconductor chip and the wires with a resin such that a lower surface of the die pad opposite to the upper surface, the portion of each of the suspension leads, the portion of each of the first leads, and the portion of each of the second leads are exposed, and thereby forming a sealing body,
- wherein a shape in plan view of the sealing body is comprised of quadrangle,
- wherein the suspension leads extend from the die pad to a plurality of corner portions of the sealing body, in the plan view,
- wherein each of the suspension leads has one end portion connected to the die pad, the other end portion opposite to the one end portion, and an intermediate portion located between the one end portion and the other end portion, and
- wherein some of the second leads are connected at the intermediate portion of each of the suspension leads, or at the die pad side of each of the suspension leads from the intermediate portion.
6 more elements
A semiconductor device comprising:
- a die pad;
- a plurality of suspension leads supporting the die pad;
- a plurality of first leads spaced apart from the die pad and arranged adjacent to the die pad;
- a plurality of second leads spaced apart from the die pad and supporting the suspension leads;
- a semiconductor chip having a front surface, a plurality of bonding pads formed over the front surface, and a rear surface opposite to the front surface and mounted over the upper surface of the die pad such that the rear surface faces to the upper surface of the die pad;
- a plurality of wires electrically connecting the bonding pads with the first leads, respectively;
- and
- a sealing body sealing therewith the semiconductor chip and the wires,
- wherein a lower surface of the die pad opposite to the upper surface, the portion of each of the suspension leads, the portion of each of the first leads, and the portion of each of the second leads are exposed from the sealing body,
- wherein a shape in a plane view of the sealing body is comprised of quadrangle,
- wherein the suspension leads extend from the die pad to a plurality of corner portions of the sealing body, in the plan view,
- wherein each of the suspension leads has one end portion connected to the die pad, the other end portion opposite to the one end portion, and an intermediate portion located between the one end portion and the other end portion, and
- wherein some of the second leads are connected at the intermediate portion of each of the suspension leads, or at the die pad side of each of the suspension leads from the intermediate portion.
10 more elements
Dependencies are inferred from the claim text.