Stacked chip-on-board module with edge connector
AssigneeTessera, Inc.
InventorsWael Zohni, Belgacem Haba
Life of this patent
Estimating the term…
Abstract
A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto.
Claims30
A module, comprising:
- a module card having a first surface, a second surface, and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket;
- and
- first and second microelectronic elements having front surfaces facing the first surface of the module card, each microelectronic element being electrically connected to the module card, the front surface of the second microelectronic element partially overlying a rear surface of the first microelectronic element and attached thereto.
A module, comprising:
- a module card having a first surface, a second surface, and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket;
- first and second microelectronic elements, the first microelectronic element having a rear surface facing the first surface of the module card, the second microelectronic element having a front surface facing the first surface of the module card, each microelectronic element being electrically connected to the module card, the second microelectronic element partially overlying a front surface of the first microelectronic element and attached thereto;
- and
- a plurality of leads extending from chip contacts of the second microelectronic element to the edge contacts.
A module, comprising:
- a lead frame having a first surface, a second surface, and a plurality of exposed module contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket;
- first and second microelectronic elements having front surfaces facing the first surface of the lead frame, each microelectronic element being electrically connected to the lead frame, the front surface of the second microelectronic element partially overlying a rear surface of the first microelectronic element and attached thereto;
- and
- an encapsulant covering the first and second microelectronic elements and a portion of the lead frame.
A method of fabricating a module, comprising:
- providing a module card having a first surface, a second surface, and a plurality of exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket;
- mounting first and second microelectronic elements onto the module card, such that front surfaces of the first and second microelectronic elements face the first surface of the module card, and such that the front surface of the second microelectronic element partially overlies a rear surface of the first microelectronic element and is attached thereto;
- and
- electrically connecting the first and second microelectronic elements to the module card.
Dependencies are inferred from the claim text.