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US 2012/0267770 A1Published application
Device and method including a soldering process
AssigneeInfineon Technologies AG
InventorsPaul Ganitzer, Francisco Javier Santos Rodriguez, Martin Sporn, Daniel Kraft
Life of this patent
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Abstract
A device and method of making a device is disclosed. One embodiment provides a substrate. A semiconductor chip is provided having a first surface with a roughness of at least 100 nm. A diffusion soldering process is performed to join the first surface of the semiconductor chip to the substrate.
Claims10
A device, comprising:
- a substrate;
- a semiconductor chip mounted on the substrate;
- and
- an intermetallic phase located at an interface between the semiconductor chip and the substrate, and a surface of the semiconductor chip at the interface has a roughness of at least 100 nm.
1 more element
A device, comprising:
- a substrate;
- a semiconductor chip comprising a semiconductor material at a first surface, the semiconductor material exposed at the first surface having a roughness of more than 500 nm;
- at least one metal layer deposited on the first surface of the semiconductor chip, wherein the at least one metal layer has a roughness of more than 500 nm;
- and
- wherein the semiconductor chip is coupled to the substrate having the at least one metal layer.
2 more elements
Dependencies are inferred from the claim text.