Solid-state imaging device and method for manufacturing the same
AssigneePanasonic Corporation
InventorsSHIGERU SUZUKI, HIROFUMI OHNAKA, KOUICHI YAMAMOTO
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AssigneePanasonic Corporation
InventorsSHIGERU SUZUKI, HIROFUMI OHNAKA, KOUICHI YAMAMOTO
Estimating the term…
A solid-state imaging device includes: a light receiving portion formed on a semiconductor substrate; a multilayer structure formed on the semiconductor substrate, that includes an interlayer insulating film and a first concave portion at a position corresponding to the light receiving portion; and an optical waveguide formed in the first concave portion. The optical waveguide includes a first film and a second film formed sequentially from a side of the multilayer structure. The first film covers a side face and a bottom face of the first concave portion and includes a second concave portion. The second film is in contact with the first film and fills up the second concave portion. The thickness of the first film formed on the side face of the first concave portion is thinner at a top portion of the first concave portion than at the bottom portion thereof.
A solid-state imaging device, comprising:
A solid-state imaging device manufacturing method, comprising:
Dependencies are inferred from the claim text.