Mounting substrate, light emitting body, and method for manufacturing mounting substrate
AssigneeKYOCERA Corporation
InventorsJunichi Watari, Yoshihiro Okawa
Life of this patent
Estimating the term…
Abstract
A mounting substrate configured to mount a functional element thereon is provided. The mounting substrate includes an insulating base having a flat surface portion and a bank portion protruding from the flat surface portion and dividing the flat surface portion into a plurality of regions; and a conductor layer configured to electrically connect the functional element thereto. The conductor layer is adhered from the flat surface portion to a side surface of the bank portion on the base, and the regions divided by the bank portion are filled with the conductor layer.
Claims11
A mounting substrate configured to mount a functional element thereon, comprising:
- an insulating base comprising
- a flat surface portion and
- a bank portion protruding from the flat surface portion and dividing the flat surface portion into a plurality of regions;
- and
- a conductor layer configured to electrically connect the functional element thereto, wherein
- the conductor layer is adhered from the flat surface portion to a side surface of the bank portion on the base, and the regions divided by the bank portion are filled with the conductor layer.
A method for manufacturing a mounting substrate, comprising:
- obtaining a green compact comprising a flat surface portion and a bank portion protruding from the flat surface portion by press molding a mixture of ceramics material powder;
- obtaining a sintered body by firing the green compact;
- filling regions of the flat surface portion divided by the bank portion on the sintered body, with paste composed mainly of a conductor material;
- and
- forming a conductor layer that fills the regions divided by the bank portion by heating the paste in a state in which the regions are filled with the paste.
Dependencies are inferred from the claim text.