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US 2012/0267351 A1Published application
Method for dicing wafer stack
OwnerShih-Tsun HUANGinventor
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Abstract
A method for dicing a wafer stack having a first wafer and a second wafer stacked under the first wafer includes the steps of cutting the first wafer by a cutting blade to form a first cutting location on the first wafer, then cutting the first wafer by a laser stealth dicing process to form a second cutting location on the first wafer, and then removing the portion defined by the first and second cutting locations. In this way, it can avoid the to-be-removed portion from flying off from the first wafer during cutting.
Claims5
A method for dicing a wafer stack, comprising the steps of:
- a) providing a first wafer and a second wafer stacked under the first wafer;
- b) cutting the first wafer by using a cutting blade to form a first cutting location on the first wafer;
- c) cutting the first wafer by a stealth dicing process using a laser cutting machine to form a second cutting location on the first wafer in a way that the second cutting location is spaced from the first cutting location and a to-be-removed portion is defined between the first and second cutting locations;
- d) removing the to-be-removed portion from the first wafer by breaking the to-be-removed portion at the second cutting location, and
- e) cutting the second wafer by using the blade to form a plurality of chips.
2 more elements
Dependencies are inferred from the claim text.