Package substrate and fabricating method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDong Gyu LEE, Jin Won Choi, Sung Won Jeong, Dae Young Lee, Gi Sub Lee, Jin Ho Kim
Life of this patent
Estimating the term…
Abstract
Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.
Claims12
A package substrate comprising:
- a substrate including at least one conductive pad;
- an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed;
- a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insualtion layer;
- a metal post made of at least one alloy material and formed on the blister prevention layer;
- and
- a heat-diffusion prevention film formed on the metal post.
A method for fabricating a package substrate, the method comprising:
- preparing a substrate which includes at least one conductive pad;
- forming an insulation layer on the substrate, the insulation layer including an opening through which the conductive pad is exposed;
- forming a blister prevention layer along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer;
- forming a metal post on the blister prevention layer by electro plating;
- and
- forming a heat-diffusion prevention film on the metal post by electro or electroless plating.
Dependencies are inferred from the claim text.