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US 2012/0267239 A1Published application
Single-layer pcb microfluidics
AssigneeCalifornia Institute of Technology
InventorsSamson CHEN, Aditya RAJAGOPAL, Axel SCHERER
Life of this patent
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Abstract
A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant.
Claims20
A microfluidic structure comprising:
- a substrate encapsulated in an encapsulant;
- one or more microfluidic channels disposed on or within the substrate;
- and,
- at least one fluidic connection soldered to the substrate or metallic structures disposed on the substrate and wherein the at least one fluidic connection is in fluidic communication with at least one microfluidic channel of the one or more microfluidic channels and is configured to enable flow of an etchant to or from the at least one microfluidic channel and some portion of the at least one fluidic connection is encapsulated within the encapsulant.
1 more element
A method for forming a microfluidic structure comprising:
- depositing one or more outer layer traces on a surface of a substrate;
- attaching one or more fluidic connections at selected locations on or near the one or more outer layer traces;
- encapsulating the substrate and the one or more outer layer traces with an encapsulant;
- after encapsulating the substrate, providing etchant to the one or more outer layer traces through at least one of the one or more fluidic connections;
- etching material comprising the one or more outer layer traces with the etchant;
- and
- removing the material comprising the one or more outer layer traces through at least one of the one or more fluidic connections,
- whereby removal of the material comprising the one or more outer layer traces results in the formation of one or more outer layer microfluidic channels within the encapsulant at the surface of the substrate.
5 more elements
A microfluidic structure comprising:
- a substrate;
- a microfluidic channel contained within the substrate;
- a first fluidic connector projecting through a first surface of the substrate and in contact with the microfluidic channel, wherein the first fluidic connector comprises a first metallic tube comprising a first solderable metal and the first metallic tube is contained within a first via hole of the substrate;
- and
- a first annular solder seal around the fluidic connector at a location where the first fluidic connector projects through the first surface of the substrate.
2 more elements
Dependencies are inferred from the claim text.