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US 2012/0267158 A1Published application
Construction of reliable stacked via in electronic substrates - vertical stiffness control method
AssigneeInternational Business Machines Corporation
InventorsKaran Kacker, Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha
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Abstract
A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes an etched pattern.
Claims8
A substrate via structure for reducing vertical stiffness, the structure comprising:
- a plurality of stacked vias, wherein each via is disposed on a disc-like structure, wherein the disc-like structure comprises:
- a platted through-hole landing comprising an etched pattern.
A method of fabricating a substrate via structure for reducing vertical stiffness, said method comprising:
- providing a plurality of disc-like structures comprising a platted through-hole landing comprising an etched pattern;
- and
- providing a plurality of stacked vias, wherein each via is disposed on the disc-like structure.
Dependencies are inferred from the claim text.