Coupling device, assembly having a coupling device, and method for producing an assembly having a coupling device
AssigneeRobert Bosch GmbH
InventorChristian Solf
Life of this patent
Estimating the term…
Abstract
The invention relates to a method for a coupling device (1) for connecting an electrical/electronic component (16), in particular a sensor (17), having a substrate, in particular a circuit board, wherein the coupling device (1) comprises at least one electrical connection (25) for electrical contacting and at least one damper element (12) for movement uncoupling, wherein the electrical connection is formed by a lead frame (3) and the lead frame (3) is overmolded in regions by a damping mass (11) as a damper element (12). The invention furthermore relates to an assembly having a coupling device and a method for producing said type of assembly.
Claims14
A coupling device (1) for connecting an electrical/electronic structural part (16), having a substrate, wherein the coupling device (1) comprises at least one electrical connection (25) for the making of electrical contact and at least one damper element (12) for the decoupling of movement, characterized in that the electrical connection is formed by a punched mesh (3) and the punched mesh (3) is encapsulated at least in certain regions by a damping mass (11) as the damper element (12).
An assembly having at least one electrical/electronic structural part (16), which can be arranged on a substrate, and having a coupling device (1) for connecting the structural part to the substrate, wherein the coupling device (1) comprises at least one electrical connection (25) for the making of electrical contact and at least one damper element (12) for the decoupling of movement, characterized by the coupling device (1) being formed by a punched mesh (3) and the punched mesh (3) is encapsulated at least in certain regions by a damping mass (11) as the damper element (12).
A method for producing an assembly, wherein the assembly comprises at least one electrical/electronic structural part, which can be arranged on a substrate, and a coupling device for connecting the structural part to the substrate, wherein the coupling device comprises at least one electrical connection for the making of electrical contact and at least one damper element for the decoupling of movement, the method comprising forming the connection by a punched mesh, and encapsulating the punched mesh in certain regions by a damping mass to form the damper element.
Dependencies are inferred from the claim text.