Method of manufacturing power module substrate and power module substrate

Abstract

[Task] To provide a method of manufacturing a power module substrate and a power module substrate in which multilayers of ceramic substrates and metal plates are laminated, the metal plates on both sides of the ceramic substrates can be in a connected state, and, furthermore, separation between the ceramic substrate and the metal plate, cracking in the ceramic substrates, and the like do not easily arise. [Means for Resolution] When the ceramic substrate 2 and the metal plates 4A, 4C, 4D, 5A, and 6 are laminated, the columnar metallic members 12 that are longer than the penetration holes 11 are inserted into the penetration holes 11 in the ceramic substrate 2, and, when the ceramic substrates and the metal plates are bonded, the metallic members 12 are pressurized and plastically deformed so that the metal plates 5A, 4A, and 4D on both sides of the ceramic substrate 2 are in a connected state through the metallic members 12 in a state in which interspaces are formed between the metallic members 12 and the penetration holes 11.

Dependencies are inferred from the claim text.