Microchip and Method of Manufacturing the Same
AssigneeRohm Co., Ltd.
InventorsShun Momose, Hiroki Takeuchi
Life of this patent
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Abstract
Provided are a microchip including a fluid circuit consisting of a space formed therein, a light-absorbing first substrate and a light-transmitting second substrate bonded onto the first substrate, and a groove, having a V-shaped section, extending parallelly to the fluid circuit on a surface of the second substrate opposite to the first substrate on a position immediately above at least part of the fluid circuit and a method of manufacturing the same.
Claims15
A microchip, comprising a fluid circuit consisting of a space formed therein, moving a liquid present in said fluid circuit to a desired position in said fluid circuit,
- including a light-absorbing first substrate and a light-transmitting second substrate bonded onto said first substrate, and
- further including a groove, having a V-shaped section, extending parallelly to said fluid circuit on a surface of said second substrate opposite to said first substrate on a position immediately above at least part of said fluid circuit.
A microchip, comprising a fluid circuit consisting of a space formed therein, moving a liquid present in said fluid circuit to a desired position in said fluid circuit,
- including a light-absorbing first substrate and a light-transmitting second substrate bonded onto said first substrate, wherein
- said fluid circuit consists of a space formed by a groove provided on a surface of said second substrate closer to said first substrate and said first substrate, and
- the microchip further comprises a tapered structure portion including a protrusion having a sectional shape of an isosceles triangle and an apical angle of 90°.
A microchip comprising a first substrate having a recess portion divided by a partition on at least a first surface and a second substrate bonded onto at least said first surface of said first substrate, and
- including a fluid circuit constituted of said recess portion and a surface of said second substrate, wherein
- at least part of a forward end of said partition of said first substrate dividing said recess portion is welded to said second substrate through a welding rib.
A method of manufacturing a microchip, comprising:
- a molding step of molding a first substrate having a recess portion divided by a partition wall on at least a first surface;
- a stacking step of stacking a second substrate on at least said first surface of said first substrate;
- and
- a bonding step of bonding said first substrate and said second substrate to each other by welding a forward end of said partition of said first substrate to said second substrate for forming a fluid circuit constituted of said recess portion and a surface of said second substrate, wherein
- a welding rib is formed on at least part of a forward end of said partition of said first substrate dividing said recess portion, and
- said partition dividing said recess portion is welded to said second substrate through said welding rib in said bonding step.
Dependencies are inferred from the claim text.